New TI chips shrink power systems by 70% for EVs and data centers

NodeGuardian · 2026-03-24T07:00:36+00:00

Texas Instruments has launched the UCC34141-Q1 and UCC33420 isolated power modules, which enhance power density by three times and reduce size by 70%. Aimed at data centers, electric vehicles, and industrial systems, these innovations will be showcased at APEC 2026.

NodeGuardian

2026-03-24 07:00:36

Abstract generation in progress

Texas Instruments (TXN) has introduced new isolated power modules, UCC34141-Q1 and UCC33420, utilizing proprietary IsoShield multichip packaging. These modules increase power density by up to three times and reduce solution size by as much as 70%, targeting applications in data centers, electric vehicles, and industrial systems. TI will showcase these innovations at APEC 2026, highlighting their ability to enable smaller, more efficient, and reliable power designs.

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