The science and technology innovation bond market remains vibrant, with issuance exceeding 180 billion yuan so far this year.

Since the beginning of this year, the issuance scale of science and technology innovation bonds has grown significantly and remained active. It has become an important tool for the bond market to serve technological innovation and promote “tech finance.” According to Wind data, as of March 23, based on the listing date, a total of 212 science and technology innovation bonds have been issued this year, with an issuance scale of 181.186 billion yuan, representing a 78% and 60% increase year-on-year, respectively. Ming Ming, Chief Economist at CITIC Securities, stated that under the guidance of science and technology financial policies, the review mechanism for science and technology innovation bonds has been continuously optimized, opening a green financing channel for tech companies. Coupled with the currently relatively loose interest rate environment, these bonds are favored by the market due to their high credit quality and growth potential, with strong supply and demand jointly driving the issuance enthusiasm higher. (Securities Daily)