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Korean media: ASML is developing wafer-to-wafer hybrid bonding equipment, which is expected to significantly shorten the production cycle
Golden Finance reports that on April 29th, according to Korean media The Elec, Professor Joo Seung-hwan of Inha University in South Korea revealed at the Advanced Packaging Technology Conference in Seoul that, through patent analysis, Dutch lithography giant ASML may be leveraging its flagship lithography platform Twinscan’s technological accumulation to develop wafer-to-wafer ( hybrid bonding equipment. The Twinscan platform significantly improves manufacturing efficiency with its dual wafer stage design. If this technology is transferred to W2W hybrid bonding equipment, it could substantially shorten the production cycle of direct wafer bonding. This latest development indicates that ASML is attempting to extend its dominance in lithography to the packaging sector. ) Dongxin News (